Fabrication method of semiconductor integrated circuit device

ABSTRACT

A fabricating method of a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in distal ends thereof and project into the air vents. By clamping the mold in a state that the distal ends of the movable pins are pushed to a multi-cavity board at the time of clamping the mold, resin can be filled while leaking air inside the cavity through the grooves formed in the distal ends of the movable pins by setting the depths of the respective air vents to a fixed value irrespective of the irregularities of thicknesses of multi-cavity boards. Accordingly, it is possible to prevent the occurrence of insufficient filling of resin in the cavity, the occurrence of leaking of resin or defective welding whereby a yield rate of products can be enhanced.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a fabrication technique of asemiconductor integrated circuit device, and more particularly to atechnique which is effectively applicable to resin molding in assemblyusing boards.

[0002] In the conventional resin molding, opening degree adjustmentmeans which adjusts an opening degree of each air vent portion isprovided to the air vent portion of a mold and a driving mechanism whichdrives the opening degree adjustment means is provided (for example,refer to Patent Document 1). Patent Document 1: Japanese UnexaminedPatent Publication No. Hei 10(1998)-92853 (FIG. 1)

[0003] To perform transfer molding by mounting semiconductor integratedcircuit chips on a multilayered printed wiring circuit board or the likeand inserting the multilayered printed wiring circuit board or the likebetween molds, different from general lead frames having relativelysmall thickness error or the like, the thickness error is relativelylarge and hence, there arise various drawbacks.

[0004] That is, when the thickness is excessively small, a gap is formedbetween an upper mold and a peripheral portion of the board and hence,leaking of sealed resin occurs. Accordingly, to compensate for the smallthickness, a clamping force is increased so as to depress the board byapproximately 1% of the thickness thus preventing the leaking of sealedresin. However, in this case, when the thickness is excessively large,the excessive deformation arises in the board.

[0005] Further, it may be considered that the occurrence of voids or thelike due to clogging of resin in the air vent portion can be suppressedby preliminarily preparing data corresponding to a thickness of a leadframe at the time of performing resin molding (resin filling) andadjusting opening degree adjustment means in the air vent portion of asealed mold by inputting such data at the time of sealing resin.However, in such a resin sealing operation, there arise drawbacks thateach time the thickness of the lead frame is changed, it is necessary toperform the alternation operation of inputting data and, at the sametime, it is necessary to prepare input data for adjusting the openingdegree adjustment means corresponding to the frame thickness.

[0006] Further, when the resin sealing operation is performed using aresin-made board which is softer than the lead frame, unevenness isliable to be generated on a surface of the board due to warping of theboard or presence/non-presence of wiring and hence, in theabove-mentioned resin sealing operation, there arises a drawback thatthe opening degree adjustment of the air vent portion in response to thechange of thickness of the board and the shape of the surface of theboard is extremely difficult.

[0007] Further, when it is necessary to perform resin molding of aplurality of boards using one mold at a time, the above-mentioned methodrequires a driving mechanism of open degree adjustment means in thesealing mold for every air vent portion and hence, the structure of thesealing mold becomes complicated and large-sized.

[0008] Accordingly, it is an object of the present invention to providea fabrication method of a semiconductor integrated circuit device whichcan enhance a yield rate of products.

[0009] It is a further object of the present invention to provide afabrication method of a semiconductor integrated circuit device whichcan reduce a fabrication cost.

[0010] It is a still further object of the present invention to providea fabrication method of a semiconductor integrated circuit device whichcan prevent the occurrence of drawbacks at the time of transportingboards in succeeding steps.

[0011] It is another object of the present invention to provide afabrication method of a semiconductor integrated circuit device whichcan reduce a mold clamping force.

[0012] The above-mentioned and other objects and novel features of thepresent invention will become apparent from the description of thisspecification and attached drawings.

SUMMARY OF THE INVENTION

[0013] To briefly explain the summary of typical inventions out of theinventions disclosed in the present application, they are as follows.

[0014] That is, the present invention is characterized by performingresin molding by filling sealing resin in the inside of a cavity in astate that depths of air vents in a mold for resin molding are set to afixed value.

[0015] Further, the summary of another invention of the presentapplication is described by dividing in paragraphs. That is,

[0016] 1. A fabrication method of a semiconductor integrated circuitdevice comprising the steps of:

[0017] (a) preparing a multilayered printed wiring circuit board;

[0018] (b) mounting semiconductor chips on the multilayered printedwiring circuit board;

[0019] (c) arranging the multilayered printed wiring circuit board overwhich the semiconductor chips are mounted on a mold surface of a moldfor resin molding and, thereafter, closing the mold; and

[0020] (d) filling sealing resin in the inside of a cavity formed in themold such that respective depths of a plurality of air vents formedthrough the cavity are set to a fixed value by projecting movable pinsprovided for respective air vents toward the air vent side by pushingusing a pressure of a spring.

[0021] 2. A fabrication method of a semiconductor integrated circuitdevice comprising the steps of:

[0022] (a) preparing a multilayered printed wiring circuit board;

[0023] (b) preparing a mold for resin molding which includes a cavityand a plurality of air vents which are formed to be communicated withthe cavity, wherein movable pins are provided for respective air ventsand a cavity-side depths of the movable pins in the air vents are setgreater than the depths of the movable pins at the outside of themovable pins;

[0024] (c) mounting semiconductor chips on the multilayered printedwiring circuit board;

[0025] (d) arranging the multilayered printed wiring circuit board overwhich the semiconductor chips are mounted on a mold surface of the moldand, thereafter, closing the mold; and

[0026] (e) filling sealing resin in the inside of the cavity such thatrespective depths of the plural air vents are set to a fixed value usingmovable pins provided for respective air vents.

[0027] Further, the summary of another invention of the presentapplication is described below by dividing in paragraphs.

[0028] 3. A fabrication method of a semiconductor integrated circuitdevice comprising the steps of:

[0029] (a) preparing a multilayered printed wiring circuit board;

[0030] (b) mounting semiconductor chips on the multilayered printedwiring circuit board;

[0031] (c) arranging the multilayered printed wiring circuit board overwhich the semiconductor chips are mounted on a mold surface of a moldfor resin molding and, thereafter, closing the mold; and

[0032] (d) filling sealing resin in the inside of the cavity such thatrespective depths of the plural air vents which are formed to becommunicated with the cavity of the mold are set to a fixed value byprojecting movable pins provided for respective air vents.

[0033] 4. A fabrication method of a semiconductor integrated circuitdevice according to the above-mentioned third invention, wherein groovesare formed over respective distal ends of the plural movable pins andair inside the cavity is leaked to the outside of the cavity through thegrooves formed in the respective movable pins at the time of fillingresin in the inside of the cavity.

BRIEF DESCRIPTION OF THE DRAWINGS

[0034]FIG. 1 is an enlarged partial cross-sectional view showing oneexample of the structure of a mold used in a fabrication method of asemiconductor integrated circuit device according to an embodiment ofthe present invention when the mold is in an open state;

[0035]FIG. 2 is an enlarged partial cross-sectional view showing thestructure of a cross section taken along a line A-A in FIG. 1;

[0036]FIG. 3 is a cross-sectional view of an enlarged portion showingone example of the structure of air vents at the time of filling resinin the inside of the mold shown in FIG. 1;

[0037]FIG. 4 is an enlarged partial cross-sectional view showing thestructure of a cross section taken along a line B-B in FIG. 3;

[0038]FIG. 5 is a partial cross-sectional view showing one example ofthe movable pin supporting structure of an upper mold of the mold shownin FIG. 1;

[0039]FIG. 6 is a plan view showing one example of the cavity-sidestructure of the upper mold shown in FIG. 5;

[0040]FIG. 7 is a partial cross-sectional view showing one example ofthe structure of a lower mold of the mold shown in FIG. 1;

[0041]FIG. 8 is a plan view showing one example of the structure of amold surface of the lower mold shown in FIG. 7;

[0042]FIG. 9 is an enlarged partial cross-sectional view showing thestructure of a portion C in FIG. 5;

[0043]FIG. 10 is an enlarged partial plan view showing the structure ofa portion D in FIG. 5;

[0044]FIG. 11 is an enlarged partial cross-sectional view showing thestructure of a cross section taken along a line E-E in FIG. 10;

[0045]FIG. 12 is a plan view showing one example of the structure of theupper mold of the mold for collective molding used in the fabricationmethod of the semiconductor integrated circuit device of the embodiment1 of the present invention;

[0046]FIG. 13 is a plan view showing one example of the structure of thelower mold which constitutes a couple together with the upper mold shownin FIG. 12;

[0047]FIG. 14 is a cross-sectional view showing one example of thestructure of the semiconductor integrated circuit device which isassembled by the fabrication method of the semiconductor integratedcircuit device of the embodiment 1 of the present invention;

[0048]FIG. 15 is a plan view showing one example of the structure of themulti-cavity printed wiring circuit board which is used by thefabrication method of the semiconductor integrated circuit device of theembodiment 1 of the present invention;

[0049]FIG. 16 is an enlarged cross-sectional view showing one example ofthe relationship between the printed wiring circuit board and guide pinsat the time of resin molding in the fabrication method of thesemiconductor integrated circuit device of the embodiment 1 of thepresent invention;

[0050]FIG. 17 is a plan view showing one example of the printed wiringcircuit board structure after resin molding in the fabrication method ofthe semiconductor integrated circuit device of the embodiment 1 of thepresent invention;

[0051]FIG. 18 is a plan view showing one example of a dicing line fordividing into pieces after resin molding in the fabrication method ofthe semiconductor integrated circuit device of the embodiment 1 of thepresent invention;

[0052]FIG. 19 is a plan view showing one example of the structure ofrunners and culls after resin molding in the fabrication method of thesemiconductor integrated circuit device of the embodiment 1 of thepresent invention;

[0053]FIG. 20 is a plan view showing one example of the structure afterdividing into pieces in the fabrication method of the semiconductorintegrated circuit device of the embodiment 1 of the present invention;

[0054]FIG. 21 is a bottom view showing one example of the structureafter dividing into pieces in the fabrication method of thesemiconductor integrated circuit device of the embodiment 1 of thepresent invention;

[0055]FIG. 22 is a perspective view showing the structure of asemiconductor integrated circuit device according to a modificationassembled by the fabrication method of the semiconductor integratedcircuit device of the embodiment 1 of the present invention;

[0056]FIG. 23 is a side view showing with a part broken away thestructure of the semiconductor integrated circuit device shown in FIG.22;

[0057]FIG. 24 is a plan view showing one example of the structure at thetime of completion of resin molding in the manufacture of thesemiconductor integrated circuit device shown in FIG. 22;

[0058]FIG. 25 is a plan view showing one example of the structure of anupper mold of a mold for simultaneously molding a plurality ofsemiconductor integrated circuit devices used in a fabrication method ofa semiconductor integrated circuit device according to an embodiment 2of the present invention;

[0059]FIG. 26 is a plan view showing one example of the structure of alower mold which constitutes a pair with the upper mold shown in FIG.25;

[0060]FIG. 27 is a plan view showing one example of the structure of aprinted wiring circuit board after resin molding in the fabricationmethod of the semiconductor integrated circuit device according to theembodiment 2 of the present invention;

[0061]FIG. 28 is a cross-sectional view showing one example of thestructure of a semiconductor integrated circuit device assembled by thefabrication method of the semiconductor integrated circuit deviceaccording to the embodiment 2 of the present invention; and

[0062]FIG. 29 is a bottom view showing one example of the structure ofthe semiconductor integrated circuit device shown in FIG. 28.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0063] Embodiments of the present invention are explained in detail inconjunction with attached drawings hereinafter.

[0064] Although the explanation is mainly focused on an applicationexample to a sheet mold (an application example to an upper side sheet)hereinafter, the present invention is not limited to such anapplication. When the sheet is not used, leaking of resin or the like isliable to easily occur and hence, there exists large possibility thatthe application of the present invention becomes necessary. Further,when the sheet is used, due to a coupled effect between the presentinvention and the sheet, it is estimated that the mass productivity andthe effect of preventing leaking of resin or the like can be largelyenhanced.

[0065] In this specification, when “multilayered printed wiring circuitboard” is referred to, this implies printed wiring circuit boards in twoor more layers. Here, “two layers” means that there are two wiringlayers. Further, “wiring” includes a land array, an electrode matrix andthe like besides usual printed wiring. Further, when “semiconductorintegrated circuit device”, “integrated circuit chip”, “semiconductorchip”, “semiconductor pellet” and the like are referred to in thisspecification, they include not only those who are prepared on a siliconwafer but also those which are prepared on other board such as a TFTliquid crystal substrate or the like unless otherwise specifiedaccordingly.

[0066] Further, in the embodiments described hereinafter, when it isnecessary for the sake of convenience, the explanation is made bydividing the invention into a plurality of sections or a plurality ofembodiments. However, unless otherwise specified particularly, theseembodiments are not irrelevant to each other and there exists therelationship that one embodiment is a modification, a detailedexplanation or a complementary explanation of a portion or the whole ofother embodiment.

[0067] Further, in the embodiments described hereinafter, when thereference is made with respect to the number and the like (includingnumber, numerical values, quantity, range and the like) of elements,unless otherwise specified and unless otherwise the number and the likeof elements are definitely limited to the specific number in principle,the number and the like are not limited to such specific number and maybe a number above or below the specific number.

[0068] Further, in the embodiment described hereinafter, it is needlessto say that the constituent elements (including element steps and thelike) are not always indispensable unless otherwise specified or unlessthey are considered indefinitely indispensable in principle.

[0069] In the same manner, in the embodiments described hereinafter,when the reference is made with respect to the shape, the positionalrelationship and the like of the constituent elements, unless otherwisespecified or unless it is indefinitely considered unreasonable inprinciple, these shapes and positional relationship substantiallyinclude those which approximate or are similar to these shapes. The samegoes for the above-mentioned numerical values and ranges.

[0070] Further, in all drawings which are served for explaining theembodiments of the present invention, the constitutional elements whichhave the same functions are given same symbols and the repeatedexplanation thereof is omitted.

[0071] (Embodiment 1)

[0072]FIG. 1 is an enlarged partial cross-sectional view showing oneexample of the structure of a mold used in a fabrication method of asemiconductor integrated circuit device according to an embodiment ofthe present invention when the mold is in an open state, FIG. 2 is anenlarged partial cross-sectional view showing the structure of a crosssection taken along a line A-A in FIG. 1, FIG. 3 is a cross-sectionalview of an enlarged portion showing one example of the structure of airvents at the time of filling resin in the inside of the mold shown inFIG. 1, FIG. 4 is an enlarged partial cross-sectional view showing thestructure of a cross section taken along a line B-B in FIG. 3, FIG. 5 isa partial cross-sectional view showing one example of the movable pinsupporting structure of an upper mold of the mold shown in FIG. 1, FIG.6 is a plan view showing one example of the cavity-side structure of theupper mold shown in FIG. 5, FIG. 7 is a partial cross-sectional viewshowing one example of the structure of a lower mold of the mold shownin FIG. 1, FIG. 8 is a plan view showing one example of the structure ofa mold surface of the lower mold shown in FIG. 7, FIG. 9 is an enlargedpartial cross-sectional view showing the structure of a portion C inFIG. 5, FIG. 10 is an enlarged partial plan view showing the structureof a portion D in FIG. 6, FIG. 11 is an enlarged partial cross-sectionalview showing the structure of a cross section taken along a line E-E inFIG. 10, FIG. 12 is a plan view showing one example of the structure ofthe upper mold of the mold for collective molding used in thefabrication method of the semiconductor integrated circuit device of theembodiment 1 of the present invention, FIG. 13 is a plan view showingone example of the structure of the lower mold which constitutes acouple together with the upper mold shown in FIG. 12, FIG. 14 is across-sectional view showing one example of the structure of thesemiconductor integrated circuit device which is assembled by thefabrication method of the semiconductor integrated circuit device of theembodiment 1 of the present invention, FIG. 15 is a plan view showingone example of the structure of the multi-cavity printed wiring circuitboard which is used by the fabrication method of the semiconductorintegrated circuit device of the embodiment 1 of the present invention,FIG. 16 is an enlarged cross-sectional view showing one example of therelationship between the printed wiring circuit board and guide pins atthe time of resin molding in the fabrication method of the semiconductorintegrated circuit device of the embodiment 1 of the present invention,FIG. 17 is a plan view showing one example of the printed wiring circuitboard structure after resin molding in the fabrication method of thesemiconductor integrated circuit device of the embodiment 1 of thepresent invention, FIG. 18 is a plan view showing one example of adicing line for dividing into pieces after resin molding in thefabrication method of the semiconductor integrated circuit device of theembodiment 1 of the present invention, FIG. 19 is a plan view showingone example of the structure of runners and culls after resin molding inthe fabrication method of the semiconductor integrated circuit device ofthe embodiment 1 of the present invention, FIG. 20 is a plan viewshowing one example of the structure after dividing into pieces in thefabrication method of the semiconductor integrated circuit device of theembodiment 1 of the present invention, FIG. 21 is a bottom view showingone example of the structure after dividing into pieces in thefabrication method of the semiconductor integrated circuit device of theembodiment 1 of the present invention, FIG. 22 is a perspective viewshowing the structure of a semiconductor integrated circuit deviceaccording to a modification assembled by the fabrication method of thesemiconductor integrated circuit device of the embodiment 1 of thepresent invention, FIG. 23 is a side view showing with a part brokenaway the structure of the semiconductor integrated circuit device shownin FIG. 22, and FIG. 24 is a plan view showing one example of thestructure at the time of completion of resin molding in the manufactureof the semiconductor integrated circuit device shown in FIG. 22.

[0073] This embodiment 1 explains the fabrication method of asemiconductor integrated circuit device in which the semiconductorintegrated circuit device is assembled such that a printed wiringcircuit board is used and a sealing body 44 (see FIG. 14) is formed overthe board by performing resin molding on the board.

[0074] In this embodiment 1 , the explanation is made by taking a CSP(Chip Size Package) 43 which is assembled using a multi-cavity printedwiring circuit board (board) 40 shown in FIG. 15 as an example of thesemiconductor integrated circuit device.

[0075] The CSP 43 shown in FIG. 14 is a thin semiconductor package of achip laminated type. To explain the structure of the CSP 43, the CSP 43is constituted of a printed wiring circuit board (board) 41 which has amain surface 41 a and a back surface 41 b, wherein a chip mountingregion 40 b and leads 41 c which constitute a plurality of lines shownin FIG. 15 are formed over the main surface 41 a, two semiconductorchips 4 which are mounted on the chip mounting region 40 b of the mainsurface 41 a of the printed wiring circuit board 41 by lamination, aplurality of wires 5 which respectively connect bonding electrodes 4 bof respective semiconductor chips 4 and the leads 41 c which correspondto the bonding electrodes 4 b, the sealing body 44 which seals thesemiconductor chips 4 and the plural wires 5 with resin, and solderballs 42 which are mounted on the back surface 41 b of the printedwiring circuit board 41 and constitute a plurality of externalterminals.

[0076] Here, the CSP 43 is formed by using amulti-cavityprinted wiringcircuit board 40 over which a plurality of device regions (deviceforming regions) 40 c respectively having chip mounting regions 40 b areformed over a main surface 40 a in a matrix array. In a resin sealing(resin molding) step after wire bonding, the plural device regions 40 cwhich are arranged in the matrix array are covered with one cavity of amold 6 and resin sealing is collectively formed (hereinafter, such resinsealing method is referred to as collective molding) and, thereafter,the resin sealed structure is divided into pieces by dicing so as toform the CSP 43.

[0077] Here, the printed wiring circuit board 41 is a thin board whichis constituted by forming wiring made of copper or the like over a resinboard made of glass-epoxy-based resin or the like.

[0078] Further, the sealing body 44 is made of epoxy resin, for example,and is formed by resin molding.

[0079] Further, the wires 5 are formed of a gold line, for example.

[0080] Next, the structure of an upper mold 7 is explained whichconstitutes a first mold and a lower mold 8 which constitutes a secondmold shown in FIG. 1 which are used in the resin sealing step of thefabrication method of the semiconductor integrated circuit device ofthis embodiment 1. Here, with respect to the first mold and the secondmold, the second mold may be constituted by the upper mold 7 and thefirst mold may be constituted by the lower mold 8.

[0081] First of all, as shown in FIG. 1 and FIG. 5, the upper mold 7 ismainly constituted of cull blocks 7 a and a cavity block 7 b, whereinone collective cavity 7 h which is capable of covering the main surface40 a of the multi-cavity printed wiring circuit board 40 at the time ofperforming resin sealing is formed in the cavity block 7 b.

[0082] Further, around the collective cavity 7 h, as shown in FIG. 6, aplurality of air vents 7 c, a plurality of culls 7 d and a plurality ofgates 7 i are formed. Among these elements, the plural gates 7 i and theplural air vents 7 c are formed in parallel respectively along twoopposing longitudinal sides of the rectangular collective cavity 7 hsuch that they face each other, while the culls 7 d are formed in aplural number in the vicinity of the gates 7 i.

[0083] Further, in the upper mold 7, a plurality of movable pins 1 whichare formed such that the movable pins 1 project into respective airvents 7 c and return pins 7 f which separate the upper mold 7 from thelower mold 8 at the time of releasing the mold 6 after filling resin arearranged. As shown in FIG. 1, respective movable pins 1 are connected tomovable pin driving springs 2 such that the movable pins 1 are capableof applying a load of approximately 9.8 Newton to 49 Newton (1-5 kg) tothe multi-cavity board 40 and are formed such that the movable pins 1project respectively into the air vents 7 c.

[0084] The mold according to this embodiment 1 includes the plural airvents 7 c and is capable of performing resin molding by filling sealingresin 9 as shown in FIG. 3 by setting depths of respective air vents 7 cto a fixed value irrespective of a board thickness and a state of aboard surface such as an unevenness at the time of resin molding.

[0085] Accordingly, the movable pins 1 which have distal ends thereofrespectively projected into the air vents 7 c corresponding torespective air vents 7 c are formed, and grooves 1 a which constituteair passages as shown in FIG. 11 are formed in distal ends of respectivemovable pins 1.

[0086] Further, the movable pins 1 are connected with the movable pindriving springs 2 in the inside of the upper mold 7 such that the loadwhich is far small compared with a clamping force of the mold 6 and isset at a level which does not deform or damage the board is applied tothe multi-cavity printed wiring circuit board 40 at the time of clampingthe mold as shown in FIG. 3. Here, the clamping force of the mold 6 is,for example, 150,000 Newton or approximately 15,000 kg-weight per oneboard in a display unit of a general-purpose device, wherein a portionof the board where the clamping force acts is an annular region having awidth of approximately 1 mm around an outer portion of a mold cavity.Taking a rectangular collective mold board having a size of 151 mm×66 mmas an example, the annular region has a size of 148 mm×60 mm, a width of0.8 mm and an area of 352 mm². Further, the load which is far smallcompared with the clamping force of the mold frame 6 and does not deformor damage the board is, for example, 9.8 Newton to 49 Newton and isapproximately 1-5 kg-weight in a display of a general-purpose device(indicating a value per one movable pin). Taking the movable pin 1having a diameter of 6 mm, a portion over which this force acts is acylindrical cross-sectional area which is approximately 28 mm².

[0087] This is because, in the structure of the mold 6 according to theembodiment 1 , the resin injection pressure is not directly applied tothe respective air vents 7 c and hence, as the spring force applied tothe movable pins 1, the load at a level which allows the movable pins 1to slightly push the board is sufficient. Accordingly, only the load ofapproximately 9.8 Newton to 49 Newton (1-5 kg) is applied to the movablepins 1 using the movable pin driving springs 2.

[0088] Further, the movable pins 1 are formed such that a movable amountthereof in the vertical direction (N indicated in FIG. 3 and FIG. 9)becomes 100-200 μm, for example.

[0089] Due to such a constitution, even when there exists irregularitieswith respect to the thickness of the board or an unevenness is formedattributed to wiring or the like on the surface of the board dependingon the positions of the board, at the time of clamping the molds, thedistal ends of respective movable pins 1 which project into the airvents 7 c at respective board positions automatically correspond to theboard condition at respective board positions so that the distal ends ofrespective movable pins 1 are brought into close contact with the board.

[0090] Here, even when the stop positions of respective movable pins 1in the vertical direction differ depending on the irregularities of thethickness of the board and the condition of the board surface such as anunevenness, provided that the depths of the grooves 1 a formed in thedistal ends of respective movable pins 1 are set to a fixed value, it ispossible to set the depths for respective air vents 7 c to a fixed valueand hence, the sealing resin 9 can be filled by automatically settingthe depths of respective air vents 7 c to a fixed value.

[0091] Here, the depths of the air vents 7 c are explained.

[0092] The air vent 7 c can be classified into four portions consistingof a movable-pin front portion, a movable-pin portion (or an air ventmain portion), a movable-pin rear portion and a release portion whichare arranged in the direction from the cavity (collective cavity 7 h) toa flow passage. To explain the movable-pin front portion, assuming thatthe tolerance of thickness of the resin board is approximately ±30 μm,for example, even when the board has the largest thickness, by settingthe depth of the air vent 7 c to approximately 60 to 70 μm, theeffective air vent depth of approximately 30 to 40 μm can be ensured (inthis case, when the film 3 which constitutes the sheet is applied, thedepth is not measured from the upper mold surface but is measured fromthe lower surface of the sheet as shown in FIG. 9. When there is nosheet, it is needless to say that the depth is measured from the surfaceof the upper mold. Accordingly, assuming the usual thickness of thesheet as 50 μm, it is estimated that the actual thickness of the sheetbecomes approximately 30 μm as a result of elongation at the time ofmolding the sheet and hence, the depth of mechanical cuts for the airvents becomes the above-mentioned value + the actual thickness of thesheet in performing the sheet molding. By setting the depth of cuts toapproximately 40 to 50 μm at the movable pin portion, the value can beautomatically ensured. It is sufficient to set the depth of the cuts toapproximately 50 to 60 μm at the movable-pin rear portion. This isbecause the movable-pin rear portion is immediately connected with thereleasing portion having a depth of approximately 150 μm.

[0093] By setting the effective depth of the main portion of the airvents 7 c to a fixed value irrespective of the thickness of the printedwiring circuit board or the like (including the lead frame) in theabove-mentioned manner, it is possible to effectively prevent leaking ofresin without excessively increasing the clamping force (for example, inthe above-mentioned example, the clamping force having up to 5000kg-weight per one board can excessively deform the board).

[0094] Further, when the tolerance of the thickness of the board isslightly set in the minus direction, leaking of resin is liable toeasily occur. In the mold 6 according to the embodiment 1, since themovable pin 1 projects exceeding the mold surface 7 g, the movable pinfunctions as a plug and leaking of the sealing resin 9 (leaking ofresin) is prevented.

[0095] In the mold 6 according to the embodiment 1, as shown in FIG. 1,the depth differs between the depth (L) of the cavity side (movable pinfront portion) of the movable pin 1 in the air vent 7 c and the depth(M) of the outside (movable-pin rear portion) of the movable pin 1,wherein the depth (L) of the cavity side of the movable pin 1 is setgreater than the depth (M) of the outside of the movable pin 1. Forexample, it is preferable to set the depth L to approximately 60 to 70μm and the depth M to approximately 50 to 60 μm.

[0096] Due to such a constitution, even when the deformation such as awarp occurs in the vicinity of a path leading from the gate 7 i to thecavity on the board, there is no possibility that the air vent 7 c inthe vicinity of the gate 7 i is clogged by the board and hence, the airvent 7 c in the vicinity of the gate 7 i can be reliably ensured.

[0097] Next, the width of the air vent 7 c is explained.

[0098] In the mold 6 according to this embodiment 1, as shown in FIG.10, a vent width (P) of the air vent 7 c at the cavity side of themovable pin 1 is set smaller than a pin diameter (Q) of the movable pin1.

[0099] In other words, the pin diameter (Q) of the movable pin 1 is setlarger than the vent width (P) of the air vent 7 c at the cavity side ofthe movable pin 1.

[0100] For example, assuming the pin diameter (Q) of the movable pin 1as 5 mm, it is preferable to set the vent width (P) of the air vent 7 cat the cavity side to approximately 4 mm and a vent width (S) of the airvent 7 c at the outside of the movable pin 1 to approximately 5 mm, anda width (R) of the groove 1 a of a distal end of the movable pin 1 to 2to 3 mm.

[0101] Accordingly, the movable pins 1 function as the plugs and stopleaking of resin which occurs when the tolerance of the thickness of theboard is slightly set in the minus direction and hence, leaking of thesealing resin 9 (leaking of resin) can be surely prevented.

[0102] In the mold 6 of this embodiment 1, movable-pin rammers (pusherrods) 7 j shown in FIG. 9 which makes the movable pins 1 project to theair vent side when the mold 6 is released are formed over the upper mold7.

[0103] Due to such a constitution, when the mold 6 is released, it ispossible to further push the movable pins 1 so as to make the movablepins 1 project into the air vent side with the use of the movable-pinrammers 7 j.

[0104] The movable-pin rammers 7 j are configured such that themovable-pin rammers 7 j are held by a rammer holder 7 l and the rammerholder 7 l is capable of pushing the movable-pin rammers 7 j with aspring force of movable-pin pushup spring 7 k.

[0105] Due to such a constitution, by pushing out the movable pins 1 tothe air vent side with the use of the movable-pin rammers 7 j at thetime of releasing the mold 6, even when the sealing resin 9 intrudes theperipheries of the movable pins 1, it is possible to prevent theoperation of the movable pins 1 from being worsened and hence, it ispossible to ensure the sufficient maintenance of the operation of themovable pins 1.

[0106] Further, in the mold 6 according to the embodiment 1, the resinmolding is performed over the board and hence, a plurality of suctionholes 7 m, 8 f are formed in the upper mold 7 and the lower mold 8 suchthat upper and lower films 3 (sheets) are sucked and brought into closecontact with the mold surfaces 7 g, 8 h at the time of performing resinmolding. These films 3 are served for preventing the adhesion of resinto the wiring over the board and damages on the wiring at the time ofclamping the molds. By arranging the films 3 respectively on the moldsurface 7 g of the upper mold 7 and the mold surface 8 h of the lowermold 8 at the time of resin molding, by sucking the respective films 3through the suction holes 7 m, 8 f and by heating the mold 6 at a giventemperature (for example, approximately 180° C.), the films 3 arebrought into close contact with the respective mold surfaces 7 g, 8 hand, thereafter, the resin is filled.

[0107] Here, as shown in FIG. 1, the suction holes 7 m are formed in theupper frame 7 in the vicinity of the movable pins 1. By sucking the film3 through the suction holes 7 m before clamping the mold and also byheating the mold 6 to a given temperature so as to bring the film 3 intoclose contact with the mold surface 7 g, as shown in FIG. 2, it ispossible to bring the film 3 into contact with the grooves la formed inthe distal ends of the movable pins 1 such that the film 3 follows thecontour of the grooves 1 a.

[0108] Accordingly, even when the film 3 is arranged on the mold surface7 g, it is possible to form the grooves 1 a in the distal ends of themovable pins 1 at the time of clamping the molds as shown in FIG. 4.

[0109] Here, the films 3 which are used for resin molding are, forexample, formed of a thin film such as a fluorine-based film materialwhich has a thickness of approximately 50 μm and is extremely flexible.

[0110] On the other hand, the lower mold 8 of the mold 6 is, as shown inFIG. 7, mainly constituted of pot holders 8 b and a cavity block 8 c,wherein a plurality of pots 8 d are formed in the pot holder 8 bcorresponding to the plural culls 7 d formed in the upper mold 7.Plungers 8 g shown in FIG. 16 which push out the sealing resin 9 arearranged in the respective pots 8 d.

[0111] Further, in the cavity block 8 c of the lower mold 8, alower-mold cavity 8 e is formed as shown in FIG. 8, while guide pins 8 awhich guide the board such as the multi-cavity board 40 arranged on themold surface 8 h are mounted on the cavity block 8 c.

[0112] Here, FIG. 12 shows the upper mold 7 which is capable ofresin-molding two sheets of multi-cavity boards 40 at a time, whereincollective cavities 7 h for arranging two sheets of multi-cavity boards40 are respectively formed at both sides of a collective sealing cull 7d, while a plurality of air vents 7 c are formed in parallel at sides ofthe collective cavities 7 h opposite to the call 7 d. Each air vent 7 chas the structure which allows the air vent 7 c communicate with thecollective cavity 7 h so as to release air at the time of filling resin.Further, in each air vent 7 c, the movable pin 1 is arranged in aprojected manner.

[0113] Further, FIG. 13 shows the structure of the lower mold 8 whichforms a pair with the upper mold 7 shown in FIG. 12.

[0114] Next, the fabrication method of the semiconductor integratedcircuit device (CSP 43) of the embodiment 1 is explained.

[0115] First of all, the multi-cavity board 40 shown in FIG. 15 overwhich a plurality of device areas 40 c each of which has the chipmounting area 40 b including the chip mounting portion and a pluralityof leads 41 c (see FIG. 14) are formed in a matrix array is prepared.

[0116] Thereafter, on the chip mounting areas 40 b of the device areas40 c of the main surface 40 a of the multi-cavity board 40,semiconductor chips 4 are mounted by means of an adhesive or the like.Since the CSP 43 of the embodiment 1 is of a chip stacking type, here,firstly, the semiconductor chips 4 at the lower stage are mounted on thechip mounting areas 40 b of the respective device areas 40 c and,subsequently, the semiconductor chips 4 at the upper stage are mountedon the semiconductor chips 4 at the lower stage.

[0117] After the mounting of the chips by stacking is completed, wirebonding is performed.

[0118] That is, the bonding electrodes 4 b of the semiconductor chips 4at the lower stage and the lead 41 c corresponding to the bondingelectrodes 4 b are connected to each other by the wires 5, while thebonding electrode 4 b of the semiconductor chip 4 at the upper stage andthe lead 41 c corresponding to the bonding electrode 4 b are connectedby the wires 5.

[0119] Thereafter, resin molding is performed.

[0120] First of all, the upper mold 7 and the lower mold 8 are, forexample, heated to a temperature of 180 degree and, at the same time, asshown in FIG. 1, in the upper mold 7 and the lower mold 8 respectively,by sucking the respective upper and lower films 3 through the suctionholes 7 m, 8 f, the respective films 3 are brought into close contactwith the respective mold surfaces 7 g, 8 h.

[0121] Here, at the upper mold 7 side, the movable pins 1 are arrangedin the respective air vents 7 c in a state that the distal ends ofmovable pins 1 are projected. When the film 3 is sucked through thesucking hole 7 m, the film 3 follows the shape of the mold surface 7 gas shown in FIG. 1 and is brought into close contact with the moldsurface 7 g. At the same time, the film also follows the shape of agroove 1 a formed in the distal end of the movable pin 1 and is broughtinto close contact with the groove 1 a as shown in FIG. 2.

[0122] On the other hand, also at the lower mold 8 side, the film 3 isbrought into close contact with the mold surface 8 h.

[0123] Under such a situation, the semiconductor chips 4 are mounted onthe mold surface 8 h of the lower mold 8 and, at the same time, themulti-cavity board 40 over which the wire bonding is already completedis arranged on the mold surface 8 h of the lower mold 8. Here, themulti-cavity board 40 is positioned by the guide pins 8 a as shown inFIG. 16.

[0124] Further, a plurality of device areas 40 c of the multi-cavityboard 40 are collectively covered with one collective cavity 7 h of theupper molds 7 and, thereafter, the upper mold 7 and the lower mold 8 ofthe mold 6 are clamped together by closing them as shown in FIG. 3.

[0125] Here, since the movable pins 1 are projected in the respectiveair vents 7 c, slightly before the upper mold 7 and the lower mold 8 arecompletely closed, the distal ends of the movable pins 1 are broughtinto contact with the main surface 40 a of the multi-cavity board 40.Further, immediately after such a contact, the upper mold 7 and thelower mold 8 are closed. Thereafter, since a spring force is alwaysapplied to the movable pins 1 by the movable-pin driving springs 2, evenafter clamping the upper mold 7 and the lower mold 8 together, eachmovable pin 1 pushes the multi-cavity board 40 toward the lower mold 8side.

[0126] That is, since the spring force of the movable pin drivingsprings 2 is far small (for example, from 9.8 Newton to 49 Newton: 1-5kg) compared with the mold clamping force (for example, 150,000 Newton:15,000 kg), even after clamping the molds together, each movable pin 1pushes the multi-cavity board 40 to the mold surface 8 h of the lowermold 8 in each air vent 7 c. Here, since the load applied by pushing isextremely small, it is possible to prevent the multi-cavity board 40from being deformed or damaged.

[0127] Due to such a constitution, an air passage in each air vent 7 cis attributed to the depth and the width of the groove 1 a formed in thedistal end of the movable pin 1. Since the grooves 1 a formed in therespective movable pins 1 have the same depth and the same width inrespective air vents 7 c, irrespective of irregularities of thethickness of the board or the surface condition of the board such asunevenness in respective air vents 7 c, it is possible to form the airvent structure shown in FIG. 4. As a result, the depths of respectiveair vents 7 c can be set to a fixed value.

[0128] Thereafter, in a state that the depths of respective air vents 7c are set to a fixed value, as shown in FIG. 16, the sealing resin 9 ispushed out by the plunger 8 g so that the sealing resin 9 is filled inthe collective cavity 7 h as shown in FIG. 3.

[0129] At the time of filling the resin, even when the multi-cavityboard 40 is formed with a slightly larger thickness due toirregularities in thickness, the respective air vents 7 c have a fixeddepth due to the grooves 1 a formed in the distal ends of respectivemovable pins 1 (the digging depths of the movable pin portionseventually determining the depths of the air vent movable pin portions;in sheet molding, a value obtained by subtracting an actual thicknessfrom the digging depths of the movable pin portions determining thedepths of the air vent movable pin portions) and hence, it is possibleto surely leak the air from the collective cavity 7 h whereby theoccurrence of a state that the sealing resin 9 is not sufficientlyfilled (a resin unfilled state) can be prevented.

[0130] Further, even the multi-cavity board 40 is formed with a slightlysmaller thickness due to the irregularities in thickness, the respectiveair vents 7 c have a fixed depth due to the grooves 1 a formed in thedistal ends of respective movable pins 1 in the same manner and hence,the occurrence of leaking of resin and the occurrence of welding defectwhich is a defect attributed to voids in a surface of the sealing bodycan be obviated.

[0131] Accordingly, the occurrence of defects can be reduced and hence,a yield rate of the products can be enhanced.

[0132] Especially, when the multi-cavity board 40 is a board which isformed of resin, unevenness attributed to warping of the board or thepresence or non-presence of wiring is liable to easily occur. In themold 6 according to the embodiment 1, the depths of respective air vents7 c can be set to a fixed value irrespective of the conditions of thesurface of the board.

[0133] Further, the occurrence of the defects can be reduced and theyield rate can be enhanced in the above-mentioned manner, in anappearance inspection carried out after completion of the resin sealingoperation, the inspection flow becomes smooth and hence, the throughputof the appearance inspection can be enhanced.

[0134] Further, the occurrence of leaking of resin can be prevented inthe air vents 7 c and hence, the occurrence of adhesion of resin to themain surface 40 a of the multi-cavity board 40 outside an allowablerange can be prevented.

[0135] Accordingly, in the succeeding process after completion of resinsealing, for example, when the multi-cavity board 40 is arranged at achute of a dicer (a board transfer jig), it is possible to prevent theoccurrence of drawbacks, for example, that the board cannot be placed inthe chute because resin which adheres to an outer peripheral portion orthe like of the board by leaking of resin is caught.

[0136] Further, the mold 6 according to this embodiment 1 adopts thestructure in which the depths of respective air vents 7 c areautomatically set to a fixed value due to the movable pins 1 mounted onthe upper mold 7 at the time of clamping the molds, as a mold clampingforce, it is sufficient to set a load which is slightly larger than aresin injection pressure irrespective of the structure of the lower mold8. As a result, the mold clamping force can be reduced compared with amold clamping force for the conventional mold.

[0137] Since the mold clamping force can be reduced in this manner, aload applied to the board at the time of clamping the mold can bereduced, whereby the occurrence of drawbacks such as the formation ofcracks in the board or the deformation of the board can be prevented.

[0138] Further, since this embodiment adopts the mold structure in whichthe depths of respective air vents 7 c can be set to a fixed value dueto the movable pins 1 which are mounted on the upper mold 7 irrespectiveof the thickness of the board, an allowable range (tolerance) of thethickness of the board such as the multi-cavity board 40 or the like canbe broadened.

[0139] Accordingly, the fabrication cost of the board can be reduced andhence, the fabrication cost of the semiconductor integrated circuitdevice such as CSP 43 or the like can be reduced.

[0140] When the resin sealing is finished and the mold 6 is opened, themulti-cavity board 40 which is sealed by resin is taken out from themold 6.

[0141] Here, on the main surface 40 a of the multi-cavity board 40, asshown in FIG. 19, the collective sealing portion 45 which is formed bythe collective molding is formed and, at the same time, runner resins47, cull resin 48, gate resin 49 and the like are formed.

[0142] Thereafter, the runner resin 47, the cull resin 48, the gateresin 49 and the like are removed from the collective sealing portion 45to obtain a state as shown in FIG. 17. Further, the multi-cavity board40 is cut into individual pieces per each device area 40 c.

[0143] Here, the dicing is performed along dicing lines 46 shown in FIG.18 and the multi-cavity board 40 is cut off together with the collectivesealing portion 45 and, thereafter, the multi-cavity board 40 is dividedinto single pieces as shown in FIG. 20.

[0144] Thereafter, as shown in FIG. 21, the assembling of the CSP 43 iscompleted by mounting a plurality of solder balls 42 on the back surface41 b of the printed wiring circuit board 41 which is formed by thedivision of the multi-cavity board into single pieces.

[0145] Here, the fixing of the solder ball 42 may be performed in astate of multi-cavity board 40 before the multi-cavity board 40 isdivided into the single pieces by dicing.

[0146] In assembling the CSP 43 as explained above, at the time ofperforming the resin sealing, the film 3 (sheet) is arranged in the moldand, thereafter, the resin is filled. Therefore, the mold surface 7 g ofthe upper mold 7 is covered with the film 3 at the time of filling theresin and hence, there is no possibility that the sealing resin 9intrudes into the movable pin arranging portions connected to the airvents 7 c.

[0147] Accordingly, there is no possibility that the sealing resin 9 isclogged in the above-mentioned movable pin arranging portions and hence,it is possible to ensure the reliable operation of the movable pins 1.

[0148] It must be noted, however, that the mold 6 according to theembodiment 1 can be used even when the resin sealing is performedwithout using the film 3 such as the resin sealing using the board suchas a lead frame. In this case, there may be a possibility that thesealing resin 9 intrudes in the above-mentioned movable pin arrangingportions and the movable pins 1 are not moved due to clogged resin.However, in the mold 6 according to this embodiment 1, it is possible toforcibly push out the movable pin 1 toward the air vent side by themovable-pin rammer 7 j at the time of opening the mold 6.

[0149] Accordingly, even when the sealing resin 9 intrudes into theperiphery of the movable pin 1, the smooth operation of the movable pin1 is maintained and, at the same time, the maintenance of the operationof the movable pin 1 can be performed.

[0150] Further, as the mold clamping force, it is sufficient to set aload slightly larger than the resin injection pressure irrespective ofthe structure of the lower mold 8. As a result, the mold clamping forcecan be reduced compared with the a mold clamping force for theconventional mold.

[0151] Since the mold clamping force can be reduced in this manner, aload applied to the board at the time of clamping the mold can bereduced, the occurrence of drawbacks such as the formation of cracks inthe board or the deformation of the board can be obviated.

[0152] Further, the mold 6 according to the embodiment 1 adopts thestructure in which the depths of respective air vents 7 c areautomatically set to a fixed value at the time of clamping molds usingthe movable pins 1 mounted on the upper mold 7 and hence, cumbersomenesssuch as the preparation of input data for adjusting the opening degreeadjustment means in response to the frame thickness in advance can beomitted and hence, the resin sealing operation can be simplified.

[0153] Further, the mold 6 according to the embodiment 1 adopts thestructure in which the depths of respective air vents 7 c areautomatically set to a fixed value at the time of clamping molds due tothe movable pins 1 mounted on the upper mold 7 and hence, it is notnecessary to provide a large-sized mechanism such as a driving mechanismfor opening degree adjustment means, whereby the constitution of themold 6 can be simplified.

[0154] Accordingly, the mold 6 can be miniaturized and the cost of themold 6 can be reduced.

[0155] Next, a modification of the embodiment 1 is explained.

[0156]FIG. 22 shows a CSP 50 which uses a multi-layered printed wiringcircuit board 51 as a board and a portion of the inner structure of theCSP 50 is shown in FIG. 23.

[0157] The multi-layered printed wiring circuit board 51 is formed bylaminating a plurality of core members 51 c made of resin or the liketogether and, in an example shown in FIG. 23, two core members 51 c arelaminated to each other. A copper pattern 51 d is provided to respectivethree layers consisting of a main surface 51 a, a back surface 51 b andthe inside of the board.

[0158] Here, the copper patterns 51 d formed on the main surface 51 aand the back surface 51 b are respectively connected by through-holewiring 51 f or the like. Further, the copper patterns 51 d formed on themain surface 51 a and the back surface 51 b are respectively coveredwith and insulated by a resist film 51 e (insulation film) except forthe connection portions respectively.

[0159] In the CSP 50 shown in FIG. 23, a semiconductor chip 4 is mountedon the main surface 51 a of the multi-layered printed wiring circuitboard 51 by way of a die bonding member 10, while the bonding electrode4 b formed on the main surface 4 a of the semiconductor chip 4 and thecopper pattern 51 d formed on the multi-layered printed wiring circuitboard 51 are electrically connected by wires 5 and a plurality of solderball 53, as outer terminals, are mounted on the copper pattern 51 d ofthe back surface 51 b.

[0160] Further, the semiconductor chip 4 and a plurality of wires 5 aresealed with resin using a sealing body 52.

[0161] Further, FIG. 24 shows a state of a multi-cavity board 54 aftercollective molding in the assembly of the CSP 50 and collective sealingportion 55, air vent resin 56 and gate resin 57 are formed over themulti-cavity board 54.

[0162] Accordingly, the CSP 50 is formed such that, in the resin sealingstep of the assembling operation, the collective sealing portion 55 isformed by sealing the multi-cavity board 54 having the multi-layeredprinted wiring structure shown in FIG. 24 with resin by collectivemolding and, thereafter, the multi-cavity board 54 is divided intosingle pieces by dicing.

[0163] The CSP 50 can be also assembled by the above-mentionedfabrication method of the semiconductor integrated circuit device of theembodiment 1. When the multi-cavity board 54 having the multi-layeredprinted wiring structure is used, the irregularities in thicknessthereof is large compared with the irregularities in thickness of theboard having the single layer structure. Accordingly, the fabricationmethod of the semiconductor integrated circuit device of this embodiment1 in which the resin sealing can be performed by setting the depths ofthe air vents 7 c to a fixed value irrespective of the thickness of theboard is extremely effective and, at the same time, the cost of themulti-cavity board 54 can be reduced by alleviating the tolerance of thethickness of the multi-cavity board 54.

[0164] Further, although the CSP 43 shown in FIG. 14 or the CSP 50 shownin FIG. 22 are assembled by collective molding using the mold for thecollective mold shown in FIG. 12 and FIG. 13, with respect to thefabrication method of the semiconductor integrated circuit device ofthis embodiment 1, it is not necessary to form a new mold 6 even whenthe thickness of the board is changed when the product type is changedand hence, the mold 6 can be used in common.

[0165] Accordingly, the fabrication cost can be reduced.

[0166] (Embodiment 2)

[0167]FIG. 25 is a plan view showing one example of the structure of anupper mold of a mold for simultaneously molding a plurality ofsemiconductor integrated circuit devices used in a fabrication method ofa semiconductor integrated circuit device according to an embodiment 2of the present invention, FIG. 26 is a plan view showing one example ofthe structure of a lower mold which constitutes a pair with the uppermold shown in FIG. 25, FIG. 27 is a plan view showing one example of thestructure of the board after resin molding in the fabrication method ofthe semiconductor integrated circuit device according to the embodiment2 of the present invention, FIG. 28 is a cross-sectional view showingone example of the structure of a semiconductor integrated circuitdevice assembled by the fabrication method of the semiconductorintegrated circuit device according to the embodiment 2 of the presentinvention and FIG. 29 is a bottom view showing one example of thestructure of the semiconductor integrated circuit device shown in FIG.28.

[0168] The embodiment 2 relates to a fabrication method of thesemiconductor integrated circuit device which is assembled by using amulti-cavity board 60, wherein a plurality of the boards are arranged onone mold and these plurality of boards are sealed by resin at a time.

[0169] Here, FIG. 25 shows an upper mold 7 of the mold forsimultaneously molding a plurality of boards. In this embodiment 2, fourmulti-cavity boards 60 can be sealed by resin at a time.

[0170] With respect to the upper mold 7 shown in FIG. 25, in individualcavities 7 n which are connected to each other by way of culls 7 d andrunners 7 e, air vents 7 c are formed respectively at a side opposite tothe runners 7 e. In the same manner as the mold 6 according to theembodiment 1, movable pins 1 are mounted in respective air vents 7 c.Also with respect to the mold 6 according to the embodiment 2, themovable pins 1 perform the similar movement as that of the movable pins1 of the mold 6 according to the embodiment 1.

[0171] On the other hand, FIG. 26 shows, with respect to the lower mold8 which forms a pair with the upper mold 7 shown in FIG. 25, a state ofthe lower mold 8 after arranging a plurality of multi-cavity boards 60and performing resin sealing.

[0172] The multi-cavity board 60 shown in FIG. 26 is used for assemblingof a card-type package (semiconductor integrated circuit device) 59shown in FIG. 28. The card-type package 59 has the structure in whichtwo semiconductor chips 4 are stacked over a main surface 58 a of aboard for cards 58 and the card-type package 59 has a plurality ofsemiconductor chips 4 over which other semiconductor chips 4 are mountedclose to two semiconductor chips 4, wherein any semiconductor chips 4are connected to the board for card 58 by wire bonding.

[0173] Further, the plural semiconductor chips 4 and wires 5 are sealedby resin by a sealing body 61 and a plurality of terminals for externalconnections 64 are formed over a back surface 58 b of the board for card58 as shown in FIG. 29.

[0174] Further, FIG. 27 shows a state of the multi-cavity board 60 afterperforming the resin molding in assembling of the card type package 59,wherein a sealing portion 61, air vent resin 62 and gate resin 63 ofrespective packages are formed over the main surface 60 a of themulti-cavity board 60.

[0175] Here, also with respect to the assembling of the card typepackage 59 of the embodiment 2, the resin sealing can be performed inthe substantially same manner as the resin sealing method of theembodiment 1. That is, four multi-cavity boards 60 are arranged over themold surface 8 h of the lower mold 8 of the mold 6 and, thereafter, themold 6 is clamped and resin sealing is performed. Here, the resinsealing can be performed by setting the depths of the air vents 7 c to afixed value irrespective of the thickness of the multi-cavity board 60.

[0176] Accordingly, with the use of the fabrication method of thesemiconductor integrated circuit device of the embodiment 2, it ispossible to obtain the substantially same advantageous effects as theadvantageous effects of the embodiment 1.

[0177] Further, with the use of the movable pins 1 which are arranged inrespective air vents 7 c, the resin sealing is performed by setting thedepths of respective air vents 7 c to a fixed value irrespective of thethickness of the multi-cavity board 60. Accordingly, even when aplurality of boards are sealed with resin using one mold 6 at a time inthe same manner as the embodiment 2, without being affected by theirregularities of the thickness among the boards, the irregularities areabsorbed by the mold 6, whereby the constitution is very effective.

[0178] For example, if only one of four multi-cavity boards 60 is formedrather thick, conventionally, leaking of resin occurs with respect toother three molds when the resin sealing is performed at a time.However, the resin sealing in assembling of the semiconductor integratedcircuit device according to the embodiment 2 is not affected by theirregularities in the thickness among the boards and hence, drawbackssuch as leaking of resin, insufficient resin filling and defectivewelding can be avoided in the same manner as the embodiment 1.

[0179] Accordingly, the fabrication cost in resin sealing can bereduced.

[0180] Other fabrication method of semiconductor integrated circuitdevice according to the embodiment 2 and the other effect which can beobtained by the other fabrication method are substantially equal tothose of the embodiment 1 and hence, the repeated explanation isomitted.

[0181] Although the invention made by inventors of the presentapplication has been specifically explained in conjunction with theembodiments 1 and 2, the present invention is not limited to theabove-mentioned embodiments 1, and 2, and various modifications can bemade without departing from the gist of the present invention.

[0182] For example, although the cases in which the semiconductorintegrated circuit device is constituted of the CSP 43, 50 and the cardtype package 59 are explained in the above-mentioned embodiments 1 and2, the above-mentioned semiconductor integrated circuit device may beconstituted of other semiconductor integrated circuit device such as aBGA (Ball Grid Array) type display device, a LGA (Land Grid Array) typedisplay device or the like provided that the semiconductor integratedcircuit device is of the resin sealing type which can be assembled byperforming the resin sealing using the board.

[0183] Further, although the case in which the movable pins 1 formed onthe upper mold 7 are mounted individually one by one corresponding torespective air vents 7 c in the embodiment 1, 2, the movable pins 1 maybe a member such as a movable block piece formed as one bodycorresponding to a group of the air vents 7 c.

[0184] Further, the board may be a metal plate such as a lead frameirrespective of the board over which the printed wiring is formed.

[0185] The advantageous effects which are obtained by the typicalinvention among the inventions disclosed in the present application arebriefly recapitulated as follows.

[0186] Since the resin sealing is performed with air vents having thedepths set to a fixed value irrespective of the thickness of the board,insufficient resin filling, leaking of resin or imperfect welding withinthe cavity can be avoided and the yield rate of the products can beenhanced.

What is claimed is:
 1. A fabrication method of a semiconductorintegrated circuit device comprising the steps of: (a) forming a board;(b) mounting semiconductor chips over the board; (c) arranging the boardover which the semiconductor chips are mounted over a mold surface of amold for resin molding and, thereafter, closing the mold; and (d)setting depths of air vents communicating with cavities of the mold to afixed value and filling sealing resin in the inside of the cavities. 2.A fabrication method of a semiconductor integrated circuit deviceaccording to claim 1, wherein the board is a multilayered printed wiringcircuit board.
 3. A fabrication method of a semiconductor integratedcircuit device according to claim 2, wherein a plurality of themultilayered printed wiring circuit boards are prepared in the step (a)and the mold is closed after the plural multilayered printed wiringcircuit boards are arranged over a mold surface of one mold in the step(c).
 4. A fabrication method of a semiconductor integrated circuitdevice according to claim 2, wherein a core member of the multilayeredprinted wiring circuit board is formed of resin.
 5. A fabrication methodof a semiconductor integrated circuit device comprising the steps of:(a) preparing a multilayered printed wiring circuit board over which aplurality of device forming regions respectively having chip mountingportions are formed in a matrix array; (b) mounting semiconductor chipson the chip mounting portions of the multilayered printed wiring circuitboard; (c) arranging the multilayered printed wiring circuit board overwhich semiconductor chips are mounted on a mold surface of mold forresin molding and, thereafter, closing the mold by collectively coveringthe plural device forming regions of the multilayered printed wiringcircuit board with one cavity of the mold; (d) setting depths of airvents communicating with the cavity of the mold to a fixed value and,thereafter, filling sealing resin in the inside of the cavity; and (e)dividing the multilayered printed wiring circuit board into piecescorresponding to the device forming regions after completion of the step(d).
 6. A fabrication method of a semiconductor integrated circuitdevice according to claim 1, wherein the depths of the air vents are setto the fixed value by pushing the board to the mold surface usingmovable pins which are formed so as to project into the air vents formedin the mold.
 7. A fabrication method of a semiconductor integratedcircuit device according to claim 6, wherein a groove is formed in adistal end of each movable pin so as to leak air inside the cavity tothe outside of the cavity through the groove of the movable pin when theresin is filled into the cavity.
 8. A fabrication method of asemiconductor integrated circuit device according to claim 6, whereinrammers which make the movable pins project to the air vent side whenthe mold is released are mounted on the mold, and the movable pins aremade to project to the air vent side by the rammers at the time ofreleasing the mold.
 9. A fabrication method of a semiconductorintegrated circuit device according to claim 6, wherein the movable pinsare made to project to the air vent side by being pushed by a pressureof springs.
 10. A fabrication method of a semiconductor integratedcircuit device according to claim 9, wherein the pressure of the springsis set far smaller than a clamping force of the mold.
 11. A fabricationmethod of a semiconductor integrated circuit device according to claim1, wherein a plurality of air vents are formed in the mold, and depthsof the respective air vents are set to a fixed value at the time offilling resin.
 12. A fabrication method of a semiconductor integratedcircuit device according to claim 11, wherein the movable pins aremounted in the plural air vents and the depths of the air vents are setto a fixed value using the respective movable pins.
 13. A fabricationmethod of a semiconductor integrated circuit device according to claim1, wherein depths of the movable pins in the air vents at the cavityside are greater than the depths of the movable pins at the outsidethereof.
 14. A fabrication method of a semiconductor integrated circuitdevice according to claim 1, wherein a pin diameter of the movable pinsis set larger than a vent width of the air vents at the cavity side ofthe movable pin.
 15. A fabrication method of a semiconductor integratedcircuit device according to claim 1, wherein the air vents and movablepins which project into the air vents are formed in any one of a firstmold and a second mold of the mold, and the depths of the air vents areset to a fixed value by pushing the board toward the mold surface usingthe movable pins.
 16. A fabrication method of a semiconductor integratedcircuit device according to claim 1, wherein the air vents and movablepins which project into the air vents are formed in any one of a firstmold and a second mold of the mold, and, at the time of performing resinmolding, a film is arranged over a mold surface of a mold over which themovable pins are arranged, the film is made to follow a shape of the airvents and a shape of distal ends of the movable pins by sucking the filmthrough suction holes formed in the mold, thereby setting the depths ofthe air vents to a fixed value.
 17. A fabrication method of asemiconductor integrated circuit device comprising the steps of: (a)preparing a plurality of multilayered printed wiring circuit boards overwhich a plurality of device forming regions respectively having chipmounting portions are formed in a matrix array; (b) mountingsemiconductor chips on the chip mounting portions of the multilayeredprinted wiring circuit boards; (c) arranging the multilayered printedwiring circuit boards over which semiconductor chips are mounted on amold surface of mold for resin molding and, thereafter, closing the moldby collectively covering the plural device forming regions of the pluralmultilayered printed wiring circuit boards with respective one of aplurality of cavities of the mold; (d) setting depths of air ventscommunicating with the plural cavities of the mold to a fixed value and,thereafter, filling sealing resin in the inside of the cavities; and (e)dividing the plural multilayered printed wiring circuit boards intopieces corresponding to the device forming regions after completion ofthe step (d).
 18. A fabrication method of a semiconductor integratedcircuit device comprising the steps of: (a) preparing a board; (b)mounting semiconductor chips on the board; (c) arranging the board overwhich the semiconductor chips are formed on a mold surface of a mold forresin molding and, thereafter, closing the mold; and (d) filling sealingresin in the inside of a cavity formed in the mold by setting the depthsof air vents communicating with the cavity formed in the moldirrespective of a thickness of the board.
 19. A fabrication method of asemiconductor integrated circuit device comprising the steps of: (a)preparing a multilayered printed wiring circuit board over which aplurality of device forming regions respectively having chip mountingportions are formed in a matrix array; (b) mounting semiconductor chipson the chip mounting portions of the multilayered printed wiring circuitboard; (c) arranging the multilayered printed wiring circuit board overwhich semiconductor chips are mounted on a mold surface of mold forresin molding and, thereafter, closing the mold by collectively coveringthe plural device forming regions of the multilayered printed wiringcircuit board with one cavity of the mold by way of a sheet; (d) settingdepths of air vents communicating with the cavity of the mold to a fixedvalue and, thereafter, filling sealing resin in the inside of thecavity; and (e) dividing the multilayered printed wiring circuit boardinto pieces corresponding to the device forming regions after completionof the step (d).
 20. A fabrication method of a semiconductor integratedcircuit device according to claim 19, wherein a sheet is interposedbetween a chip mounting side of the multilayered printed wiring circuitboard and the mold which faces the chip mounting side surface of themultilayered printed wiring circuit board.